Frequently requested reprints and recent papers by Eiichi Kondoh

Effects of surface modification of carbon nanotube on platinum nanoparticle deposition using supercritical carbon dioxide fluid

Conformal Copper Coating of True Three-Dimensional Through-Holes Using Supercritical Carbon Dioxide

In-situ Spectroscopic Ellipsometry of the Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation

In situ ellipsometry of porous low-dielectric constant films in supercritical carbon dioxide

Initial Cu Growth in Cu-Seeded and Ru-Lined Narrow Trenches for Supercritical Fluid Cu Chemical Deposition

Converage of copper thin films deposited on the sidewall of though-silicon vias using supercritical fluids

Topography-sensitive copper deposition in supercritical solutions

Kinetics of Deposition of Cu Thin Films in Supercritical Carbon Dioxide Solutions from a F-Free Copper(II)-beta Diketone Complex

Condensation and cleaning of an organometallic copper compound to/from porous low-dielectric constant thin films in supercritical carbon dioxide

Deposition kinetics and narrow-gap-filling in Cu thin film growth from supercritical carbon dioxide fluids

Reduction of thin oxidized copper films using a hot-filament hydrogen radical source

Deposition of Cu thin films from supercritical carbon dioxide using hexafluoroacetylacetnatecopper

Deposition of Ru Thin Films from Supercritical Carbon Dioxide Fluids

Deposition of Cu and Ru Thin Films in Deep Nanotrenches/Holes Using Supercritical Carbon Dioxide

Paving the way for Full-Fluid IC Metallization using Supercritical Carbon Dioxide

Characterisitcs of copper deposition in a supercritical CO2 fluid

Comparative study of pore size of low-dielectric-constnat porous spin-on-glass films using different methods of nondestructive instrumentation

Effect of oxygen plasma exposure of porous spin-on-glass films