Frequently requested reprints and recent papers by Eiichi Kondoh
Initial Cu Growth in Cu-Seeded and Ru-Lined Narrow Trenches for Supercritical Fluid Cu Chemical Deposition
Converage of copper thin films deposited on the sidewall of though-silicon vias using supercritical fluids
Topography-sensitive copper deposition in supercritical solutions
Kinetics of Deposition of Cu Thin Films in Supercritical Carbon Dioxide Solutions from a F-Free Copper(II)-beta Diketone Complex
Condensation and cleaning
of an organometallic copper compound
to/from porous low-dielectric constant thin films
in supercritical carbon dioxide
Deposition kinetics and narrow-gap-filling in Cu thin film growth from supercritical carbon dioxide fluids
Reduction of thin oxidized copper films using a hot-filament hydrogen radical source
Deposition of Cu thin films from supercritical carbon dioxide using hexafluoroacetylacetnatecopper
Deposition of Ru Thin Films from Supercritical Carbon Dioxide Fluids
Deposition of Cu and Ru Thin Films in Deep Nanotrenches/Holes Using Supercritical Carbon Dioxide
Paving the way for Full-Fluid IC Metallization using Supercritical Carbon Dioxide
Characterisitcs of copper deposition in a supercritical CO2 fluid
Comparative study of pore size of low-dielectric-constnat porous spin-on-glass films using different methods of nondestructive instrumentation
Effect of oxygen plasma exposure of porous spin-on-glass films